Know About High Frequency PCB Material of Ro3003, Ro3010, RT5870, RT5880, RT6010, Ro4360, TMM10, TMM10i, TACONIC RF Series, TACONIC TLY Series, High Frequency Adhesive
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PCBs are used in various electrical equipment, including cell phones, computers, power tools, etc. These hi-tech boards are produced in many different facilities with varying grades of board material. However, PCB Material selection is a severe problem for the circuit designer because choosing a good PCB material is not just a simple decision. You need to consider many factors to make this correct decision, such as electrical parameters, physical parameters, fabrication costs, etc.
Not many people are aware of the different types of PCB materials that exist, but they can impact performance and longevity. When picking the suitable material for your next prototype, you might be overwhelmed by the number of choices available. There are a variety of high frequency PCB materials available in different forms and for various applications.
High frequency PCB materials store and exchange frequencies of 10 MHz or more. Typically made of epoxy laminate, high-frequency circuit boards are used in more than half of all microwave assemblies because they can withstand extreme temperatures and effectively control electromagnetic interference (EMI). They have been designed with low loss characteristics and smaller dimensions, which allow components to fit into places that were previously too small for them. The list of high frequency board materials in this guide will make it easier to narrow down your choices.
The Ro3003 material is a high frequency printed circuit board (PCB) material, with a thickness of 0.13 mm to 1.52 mm, used in the production of RFID tags. The Ro3003 material is made from an epoxy resin, a thermosetting plastic cured at high temperatures and pressure. The base material for the epoxy resin used to create Ro3003 is polyimide, modified using halogenated aliphatics such as bisphenol A, terephthalic acid, or p-toluenesulfonic acid.
The Ro3003 material can be used for RFID tags because of its excellent mechanical and electrical properties. It has excellent electromagnetic shielding performance, good mechanical strength, and electrical properties. Its excellent mechanical properties mean that it does not crack or break easily when subjected to stress or pressure. Its excellent electrical properties mean high dielectric strength and low dissipation factor (D).
Ro3010 is a copper-clad laminate material with excellent electrical and thermal conductivity, suitable for use in high frequency PCBs. This material is often used as the substrate layer in multilayer printed circuit boards (PCBs).
Ro3010 has excellent electromagnetic interference (EMI) shielding performance and good thermal stability under high-temperature conditions. Its mechanical properties are stable at large strains so that it can be used as a substrate with mechanical strength requirements such as connectors and heat sinks in electronic equipment. It has a high dielectric constant of 11.20 for design, making it suitable for high-frequency applications such as RF circuits, filters, circulators, and tuners. Moreover, Ro3010 has excellent solderability and can be easily soldered using conventional solder paste processes.
RT5870 is a high frequency PCB material with a dielectric constant of 2.33 and a low loss tangent. It has excellent thermal stability, low loss, and high dielectric strength. The RT5870 has excellent thermal conductivity, which can be as high as 1.5 times that of FR4. The radiation resistance of RT5870 is better than FR4 and other materials, which makes it suitable for space-bound equipment applications.
The main components of the RT5870 are copper foil and polyimide film. The copper foil surface has been coated with polyimide film to protect it from oxidation during making PCBs. With such good properties, RT5870 is ideal for use in high frequency electronic products such as mobile phones and wireless communication products, where there are strict requirements on electromagnetic interference (EMI) performance and radio frequency interference (RFI).
The appearance of RT5880 high frequency PCB material is copper foil, but with different density, thickness, and other characteristics. It can be used as a heat sink in electronic equipment such as mobile phones, computers, etc. The dielectric constant is 2.20, which can meet the requirements for microwave circuits.
RT6010 is a kind of high frequency PCB material. It is composed of zinc-tin alloy and copper. The composition of the alloy will affect the electrical performance of the product. The dielectric constant of RT6010 is 2.7, which is close to the theoretical value (2.6). Therefore, it has a low loss rate and can be used in high frequency circuits with suitable parameters. RT6010 has good properties such as good conductivity, excellent solderability, and good heat resistance. Therefore, RT6010 has been widely used in many fields, such as military and communication equipment.
The frequency PCB material of Ro4360 is a kind of high-performance copper alloy with good electrical conductivity and thermal conductivity. The high frequency PCB material of Ro4360 has good resistance to oxidation, which can effectively prevent oxidation corrosion caused by moisture absorption and increase its service life.
TMM10 is a copper-clad laminate with an aluminum core and an outer printed layer. The printed layer is made of black paper on both sides. This makes it possible to use TMM10 for high frequency PCBs. TMM10 has not only excellent anti-corrosion resistance and chemical stability but also has good dielectric properties.
The high frequency PCB material of TMM10i is made of copper-clad laminate and carbon film. The copper-clad laminate is a layer of copper foil bonded to one or both sides of the substrate with an adhesive. TMM10i is designed for use in radar and sensor systems, where high performance and reliability are required.
TACONIC RF series
TACONIC RF is a high frequency PCB material made with carbon fiber and epoxy resin. TACONIC RF series is characterized by its good dielectric properties, low thickness, and cost-effectiveness. It is suitable for applications that require high Q factors or wide bandwidths at frequencies up to 100 GHz (0.1 mm thick).
TACONIC TLY series has excellent electrical properties and low loss characteristics. It is mainly used for high frequency circuits such as microwave filters, waveguide couplers, and other components requiring high withstand voltage, high breakdown voltage, and high dielectric constant. It has excellent soldering performance and thermal conductivity, which are better than FR-4 PCB materials at the same thickness range.
High Frequency Adhesive
High frequency adhesive is the latest technology in PCB production. It can be used in producing electronic products such as hybrid integrated circuits, microwave module, electronic instrument panels, antennas, and other electronic products with high frequency requirements. This type of PCB has high frequency characteristics, excellent thermal stability, and good electrical insulation performance. It has good solderability and excellent flame retardant properties. It is mainly used for unique electronics production.
RT5880 has been tested and verified by several major equipment manufacturers, and it has been found to perform better than all commercially available materials in terms of resistance to contamination. Hemeixin’s HDI PCB is an ideal choice for any device that requires a high level of reliability or has to be built into a space where there is no room for error.